Professional printed circuit board assembly process factory
printed circuit board assembly process factory
● 4 YAMAHA High-speed SMT Lines
● 6 million daily SMT placements capability
● 400,000 daily DIP placements capability.
● 500×600 mm Maximum Board Size.
● 0.25"x 0.25" Minimum Board Size.
● 450 mm Max. Width for Wave-Solder.
● Passives Components Down to 0201 Size BGA and VFBGA Leadless Chip
Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA
Repair and ReballPart Removal and Replacement
SMT and DIP/X-RAY Inspection/AOI Testing/In-circuit-test
(ICT)/Flying Probe/Function Test/Burn-in/Finished products assembly